9,750 $
Make an offer| ------------------- | |
| worked hours | 10000 hours |
| hours under power | |
| state | in working conditions |
| At local norms | --------- |
| status | visible but unplugged |
| Last availability date | 27/03/2026 |
The Sprint T 01 is a high-speed automatic wire bonder designed specifically for the mass production of power semiconductors and power modules, with a focus on applications in the automotive industry. Manufactured in 2012, this compact and fully automatic wire bonding machine aims to deliver high productivity while maintaining a goal of zero defects. It is well-suited for environments requiring precise and efficient wire bonding processes.
The machine features a user-friendly control panel equipped with a joystick and multiple buttons, including an emergency stop and a green start button, allowing for safe and straightforward operation. A large monitor is mounted on top of the unit, providing clear visual feedback and control interface during operation. Additionally, a microscope is integrated into the front of the machine to facilitate detailed inspection and precise bonding tasks.
The control panel also includes a computer mouse, enhancing the ease of navigation through the machine's software and settings. The overall condition of the machine appears clean and well-maintained, with no visible signs of damage, indicating that it has been cared for properly.
This wire bonder is particularly adapted to meet the stringent requirements of high-volume production in the automotive sector, ensuring consistent quality and efficiency. Its compact design allows it to fit into various production setups without requiring excessive space. The combination of automation, precision components, and operator-friendly controls makes the Sprint T 01 a reliable choice for manufacturers looking to optimize their wire bonding processes.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
High speed Automatic Wire Bonder
Highly productive and always aiming for zero defects: the fully automatic, compact wire bonder SPRINT-T 01 was adapted to the special requirements of mass production of power semiconductors and power modules in the automotive industry.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Factory – small or medium company |
| Active since | 2023 |
| Offers online | 11 |
| Last activity | April 15, 2026 |
High speed Automatic Wire Bonder
Highly productive and always aiming for zero defects: the fully automatic, compact wire bonder SPRINT-T 01 was adapted to the special requirements of mass production of power semiconductors and power modules in the automotive industry.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| ------------------- | |
| worked hours | 10000 hours |
| hours under power | |
| state | in working conditions |
| At local norms | --------- |
| status | visible but unplugged |
| Last availability date | 27/03/2026 |
The Sprint T 01 is a high-speed automatic wire bonder designed specifically for the mass production of power semiconductors and power modules, with a focus on applications in the automotive industry. Manufactured in 2012, this compact and fully automatic wire bonding machine aims to deliver high productivity while maintaining a goal of zero defects. It is well-suited for environments requiring precise and efficient wire bonding processes.
The machine features a user-friendly control panel equipped with a joystick and multiple buttons, including an emergency stop and a green start button, allowing for safe and straightforward operation. A large monitor is mounted on top of the unit, providing clear visual feedback and control interface during operation. Additionally, a microscope is integrated into the front of the machine to facilitate detailed inspection and precise bonding tasks.
The control panel also includes a computer mouse, enhancing the ease of navigation through the machine's software and settings. The overall condition of the machine appears clean and well-maintained, with no visible signs of damage, indicating that it has been cared for properly.
This wire bonder is particularly adapted to meet the stringent requirements of high-volume production in the automotive sector, ensuring consistent quality and efficiency. Its compact design allows it to fit into various production setups without requiring excessive space. The combination of automation, precision components, and operator-friendly controls makes the Sprint T 01 a reliable choice for manufacturers looking to optimize their wire bonding processes.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Factory – small or medium company |
| Active since | 2023 |
| Offers online | 11 |
| Last activity | April 15, 2026 |
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