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| Wafer size | 6 in |
| ------------------- | |
| worked hours | |
| hours under power | |
| state | as-is, where-is |
| At local norms | --------- |
| status | |
| Last availability date | 30/10/2025 |
This Delvotec Die Bonder is designed for handling wafers up to 15.24 cm (6 inches) in size, suitable for semiconductor manufacturing processes. It is equipped to manage 2 by 2 cassette pick-up, facilitating efficient wafer handling during die bonding operations. The machine is part of a Chip & Wire department setup, indicating its use in semiconductor assembly stages where precise die bonding is required. The equipment is located in a clean and well-maintained laboratory or production environment, which is organized and free from visible damage or clutter. The facility features multiple specialized semiconductor wafer processing and inspection machines arranged systematically, with ventilation ducts positioned above workstations to maintain appropriate environmental conditions. The presence of office chairs and tables with various tools and equipment suggests a well-equipped workspace supporting the operation and maintenance of such machinery. This setup implies that the Delvotec Die Bonder is integrated into a professional semiconductor manufacturing workflow, ensuring proper handling and processing of wafers up to 6 inches in diameter. No specific information about the year of manufacture or additional technical specifications is provided.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Delvotec Die Bonder 6 inches Wafer
Chip & Wire dept. in the middle and Die bonder Delvotec for 2 by 2 cassette pick up and max 6 inches wafer.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Factory – small or medium company |
| Active since | 2017 |
| Offers online | 3 |
| Last activity | April 29, 2026 |
Delvotec Die Bonder 6 inches Wafer
Chip & Wire dept. in the middle and Die bonder Delvotec for 2 by 2 cassette pick up and max 6 inches wafer.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Wafer size | 6 in |
| ------------------- | |
| worked hours | |
| hours under power | |
| state | as-is, where-is |
| At local norms | --------- |
| status | |
| Last availability date | 30/10/2025 |
This Delvotec Die Bonder is designed for handling wafers up to 15.24 cm (6 inches) in size, suitable for semiconductor manufacturing processes. It is equipped to manage 2 by 2 cassette pick-up, facilitating efficient wafer handling during die bonding operations. The machine is part of a Chip & Wire department setup, indicating its use in semiconductor assembly stages where precise die bonding is required. The equipment is located in a clean and well-maintained laboratory or production environment, which is organized and free from visible damage or clutter. The facility features multiple specialized semiconductor wafer processing and inspection machines arranged systematically, with ventilation ducts positioned above workstations to maintain appropriate environmental conditions. The presence of office chairs and tables with various tools and equipment suggests a well-equipped workspace supporting the operation and maintenance of such machinery. This setup implies that the Delvotec Die Bonder is integrated into a professional semiconductor manufacturing workflow, ensuring proper handling and processing of wafers up to 6 inches in diameter. No specific information about the year of manufacture or additional technical specifications is provided.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Factory – small or medium company |
| Active since | 2017 |
| Offers online | 3 |
| Last activity | April 29, 2026 |
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