Price on request
Make an offer| Manufacturer | Rudolph Technologies |
|---|---|
| Model | NSX 105 |
| Year | |
| Location | Switzerland
|
| Category | Semiconductors - Wafer equipment |
| Product id | P240223327 |
| Language |
| ------------------- | |
| worked hours | |
| hours under power | |
| state | good |
| At local norms | --------- |
| status | visible |
| Last availability date | 06/03/2026 |
The Rudolph Technologies NSX 105 is an automated wafer inspection system designed for macro defect detection on semiconductor wafers. It is capable of identifying defects 0.5 micron and larger, providing critical quality assurance during various phases of semiconductor manufacturing. This system supports high throughput and repeatable inspection, making it suitable for applications including semiconductor fabrication, wafer bumping, MEMS, optoelectronics, micro displays, and data storage.
The NSX 105 features an advanced wafer stage enclosed within the machine, facilitating precise wafer handling during inspection. The system includes a control panel equipped with multiple buttons in green, white, and purple, as well as power and status indicator lights, enabling straightforward operation and monitoring. An emergency stop button with a yellow housing and red center is also present for safety.
Internally, the machine contains inspection mechanisms with cables, connectors, and pneumatic tubing, along with components branded by Xandex. A notable feature is a black box with a caution label indicating to avoid exposure, suggesting the presence of sensitive optical or laser elements. The control panel includes a dot size adjustment knob with minimum and maximum settings to fine-tune inspection parameters.
Additional equipment includes a Keyence Laser Focus Displacement Meter LT-8106, which may assist in precise measurement tasks during inspection. The system also features a keyboard with keys labeled RUN, LOAD, PAUSE, PRINT IMAGE, SAVE IMAGE, and magnification keys ranging from 1X to 20X, allowing flexible control over inspection operations and image handling.
The system is paired with a refurbished UltraPort-5 automated wafer inspection handling system capable of handling whole wafers and wafers on film frames ranging from 150mm to 300mm in diameter. The NSX 105 provides automated macro defect inspection, wafer probe process analysis, quick and reliable 2D bump inspection, as well as advanced process control and reporting capabilities.
Please note that the hour meter on the Xandex control panel shows 0000 hours, which may indicate limited use or a reset meter. No specific manufacturing year or power specifications are provided.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Rudolph Technologies NSX® wafer inspection systems offer high throughput along with repeatable macro wafer defect inspection for defects 0.5 micron and larger.
Macro wafer defects can occur at various phases of semiconductor manufacturing, and can have a major impact on the quality of your microelectronic devices. This cost-effective used Rudolph Technologies NSX 105 wafer inspection system quickly and accurately detects critical defects and provides quality assurance in addition to valuable process information.
The NSX 105 wafer inspection system is field proven across a wide range of applications including semiconductor, wafer bumping, MEMS, optoelectronics, micro displays and data storage.
Key features of this fully refurbished wafer inspection system:
Wafer probe process analysis
Automated macro defect inspection
Quick, reliable 2D bump inspection
Advanced process control and reporting
Fast, flexible refurbished UltraPort-5 automated wafer inspection handling system that handles 150mm through 300mm whole wafers and wafers on film frames
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 40 |
| Last activity | May 5, 2026 |
Rudolph Technologies NSX® wafer inspection systems offer high throughput along with repeatable macro wafer defect inspection for defects 0.5 micron and larger.
Macro wafer defects can occur at various phases of semiconductor manufacturing, and can have a major impact on the quality of your microelectronic devices. This cost-effective used Rudolph Technologies NSX 105 wafer inspection system quickly and accurately detects critical defects and provides quality assurance in addition to valuable process information.
The NSX 105 wafer inspection system is field proven across a wide range of applications including semiconductor, wafer bumping, MEMS, optoelectronics, micro displays and data storage.
Key features of this fully refurbished wafer inspection system:
Wafer probe process analysis
Automated macro defect inspection
Quick, reliable 2D bump inspection
Advanced process control and reporting
Fast, flexible refurbished UltraPort-5 automated wafer inspection handling system that handles 150mm through 300mm whole wafers and wafers on film frames
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| ------------------- | |
| worked hours | |
| hours under power | |
| state | good |
| At local norms | --------- |
| status | visible |
| Last availability date | 06/03/2026 |
The Rudolph Technologies NSX 105 is an automated wafer inspection system designed for macro defect detection on semiconductor wafers. It is capable of identifying defects 0.5 micron and larger, providing critical quality assurance during various phases of semiconductor manufacturing. This system supports high throughput and repeatable inspection, making it suitable for applications including semiconductor fabrication, wafer bumping, MEMS, optoelectronics, micro displays, and data storage.
The NSX 105 features an advanced wafer stage enclosed within the machine, facilitating precise wafer handling during inspection. The system includes a control panel equipped with multiple buttons in green, white, and purple, as well as power and status indicator lights, enabling straightforward operation and monitoring. An emergency stop button with a yellow housing and red center is also present for safety.
Internally, the machine contains inspection mechanisms with cables, connectors, and pneumatic tubing, along with components branded by Xandex. A notable feature is a black box with a caution label indicating to avoid exposure, suggesting the presence of sensitive optical or laser elements. The control panel includes a dot size adjustment knob with minimum and maximum settings to fine-tune inspection parameters.
Additional equipment includes a Keyence Laser Focus Displacement Meter LT-8106, which may assist in precise measurement tasks during inspection. The system also features a keyboard with keys labeled RUN, LOAD, PAUSE, PRINT IMAGE, SAVE IMAGE, and magnification keys ranging from 1X to 20X, allowing flexible control over inspection operations and image handling.
The system is paired with a refurbished UltraPort-5 automated wafer inspection handling system capable of handling whole wafers and wafers on film frames ranging from 150mm to 300mm in diameter. The NSX 105 provides automated macro defect inspection, wafer probe process analysis, quick and reliable 2D bump inspection, as well as advanced process control and reporting capabilities.
Please note that the hour meter on the Xandex control panel shows 0000 hours, which may indicate limited use or a reset meter. No specific manufacturing year or power specifications are provided.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 40 |
| Last activity | May 5, 2026 |