200,000 $ Price is negotiable
Make an offer| Wafer size | 200 in |
| ------------------- | |
| Length x width x height | 120.0 × 60.0 × 96.0 |
| Weight | 15428 lb |
| worked hours | |
| hours under power | |
| state | as-is, where-is |
| At local norms | yes |
| status | visible but unplugged |
| Datasheet | Meyer Burger AK800 ICP RIE |
| Last availability date | 08/12/2025 |
The Meyer Burger AK800 ICP RIE is a high-density inductively coupled plasma (ICP) and reactive-ion etching (RIE) system designed for precise anisotropic etching of thin-film materials. Manufactured in 2018, this system is suitable for semiconductor and photovoltaic wafer processing, supporting wafers up to 6 inches in diameter. The system features two 5 kW, 2.45 GHz microwave power supplies that feed four independent waveguides to generate a high-density plasma of free radicals, complemented by a 13.56 MHz cathode power supply to provide bias for anisotropic etching.
The chamber is equipped with both roughing and turbo pumping systems to maintain the required process vacuum. Manual loading allows processing of up to three 6-inch wafers simultaneously. The AK800 supports a broad range of process gases including BCl₃, Cl₂, CF₄, SF₆, C₄F₈, O₂, and Ar, enabling flexible etch chemistries suitable for various semiconductor device fabrication and thin-film photovoltaic manufacturing applications.
From the images, the system includes a pneumatic valve manifold with multiple FESTO valves and tubing, a black cylindrical filter or pump component with attached flexible hoses, and an aluminum frame structure supporting components and wiring. There is also a white control cabinet labeled for gas types such as Asphyxiant, Argon, Oxidizer, and Oxygen, along with various valves, sensors, and tubing connections around the equipment. The machine rests on a metal frame and grated platform.
Dimensions are approximately 120 mm in length, 60 mm in width, and 96 mm in height, with a weight of about 7000 kg. The unit is used and complete; potential buyers are encouraged to contact the seller for further questions, inspection scheduling, or shipping arrangements.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Meyer Burger AK800 ICP / RIE Etch System. (Versatile High-Density Plasma Etcher)
Manufacturer: Meyer Burger. Model: AK800 (ICP / RIE)
High-density inductively coupled plasma (ICP) based etcher / reactive-ion etch (RIE) system. Two 5 kW, 2.45 GHz microwave power supplies feed four independent waveguides to generate a high-density plasma of free radicals; a 13.56 MHz cathode power supply provides bias for anisotropic etching.
Capabilities: Anisotropic etching of most thin-film materials — suitable for semiconductor and photovoltaic thin-film / wafer processing.
Chamber & Handling: Manual load for up to three 6-inch wafers; chamber has both roughing and turbo pumping for process vacuum.
Process Gases: Supports gases including BCl₃, Cl₂, CF₄, SF₆, C₄F₈, O₂, Ar (among others) for broad etch chemistry flexibility.
Typical Use Cases: Dry etching / structuring in semiconductor device fabrication — or thin-film / photovoltaic module manufacturing.
Condition: Used, Excelent. Complete. Contact with any questions, or to schedule an inspection, or shipping arrangements. More images available upon request.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Machinery dealer |
| Active since | 2009 |
| Offers online | 4 |
| Last activity | April 7, 2026 |
Meyer Burger AK800 ICP / RIE Etch System. (Versatile High-Density Plasma Etcher)
Manufacturer: Meyer Burger. Model: AK800 (ICP / RIE)
High-density inductively coupled plasma (ICP) based etcher / reactive-ion etch (RIE) system. Two 5 kW, 2.45 GHz microwave power supplies feed four independent waveguides to generate a high-density plasma of free radicals; a 13.56 MHz cathode power supply provides bias for anisotropic etching.
Capabilities: Anisotropic etching of most thin-film materials — suitable for semiconductor and photovoltaic thin-film / wafer processing.
Chamber & Handling: Manual load for up to three 6-inch wafers; chamber has both roughing and turbo pumping for process vacuum.
Process Gases: Supports gases including BCl₃, Cl₂, CF₄, SF₆, C₄F₈, O₂, Ar (among others) for broad etch chemistry flexibility.
Typical Use Cases: Dry etching / structuring in semiconductor device fabrication — or thin-film / photovoltaic module manufacturing.
Condition: Used, Excelent. Complete. Contact with any questions, or to schedule an inspection, or shipping arrangements. More images available upon request.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Wafer size | 200 in |
| ------------------- | |
| Length x width x height | 120.0 × 60.0 × 96.0 |
| Weight | 15428 lb |
| worked hours | |
| hours under power | |
| state | as-is, where-is |
| At local norms | yes |
| status | visible but unplugged |
| Datasheet | Meyer Burger AK800 ICP RIE |
| Last availability date | 08/12/2025 |
The Meyer Burger AK800 ICP RIE is a high-density inductively coupled plasma (ICP) and reactive-ion etching (RIE) system designed for precise anisotropic etching of thin-film materials. Manufactured in 2018, this system is suitable for semiconductor and photovoltaic wafer processing, supporting wafers up to 6 inches in diameter. The system features two 5 kW, 2.45 GHz microwave power supplies that feed four independent waveguides to generate a high-density plasma of free radicals, complemented by a 13.56 MHz cathode power supply to provide bias for anisotropic etching.
The chamber is equipped with both roughing and turbo pumping systems to maintain the required process vacuum. Manual loading allows processing of up to three 6-inch wafers simultaneously. The AK800 supports a broad range of process gases including BCl₃, Cl₂, CF₄, SF₆, C₄F₈, O₂, and Ar, enabling flexible etch chemistries suitable for various semiconductor device fabrication and thin-film photovoltaic manufacturing applications.
From the images, the system includes a pneumatic valve manifold with multiple FESTO valves and tubing, a black cylindrical filter or pump component with attached flexible hoses, and an aluminum frame structure supporting components and wiring. There is also a white control cabinet labeled for gas types such as Asphyxiant, Argon, Oxidizer, and Oxygen, along with various valves, sensors, and tubing connections around the equipment. The machine rests on a metal frame and grated platform.
Dimensions are approximately 120 mm in length, 60 mm in width, and 96 mm in height, with a weight of about 7000 kg. The unit is used and complete; potential buyers are encouraged to contact the seller for further questions, inspection scheduling, or shipping arrangements.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2009 |
| Offers online | 4 |
| Last activity | April 7, 2026 |
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Waferovací stroj Meyer Burger AK800 ICP RIE
Meyer Burger AK800 ICP RIE Wafer maskine
Meyer Burger AK800 ICP RIE Waferanlage
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Meyer Burger AK800 ICP Etch System
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Machine pour wafer Meyer Burger AK800 ICP RIE
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Meyer Burger AK800 ICP RIE Wafelmachine
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Máquina de wafer Meyer Burger AK800 ICP RIE
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Mašina za vafle Meyer Burger AK800 ICP RIE
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