Price on request
View price| ------------------- | |
| worked hours | |
| hours under power | |
| state | good |
| At local norms | --------- |
| status | visible |
| Last availability date | 25/03/2025 |
Offer Title: SSEC M3302 Resist Removal and Wafer Cleaning Machine
Manufacturer: Ssec
Model: M3302
Year of Manufacture: Not specified
This semiconductor wafer equipment is designed for efficient resist removal and wafer cleaning processes. The machine features a reflective stainless steel exterior and is equipped with two cassette holders labeled 'CASSETTE 1' and 'CASSETTE 2' for wafer input and output, facilitating organized wafer handling. The front panel includes a 'CORROSIVES' label, indicating the machine is intended to process corrosive materials safely.
Operational controls include an emergency stop button and start/stop push buttons located on the right side of the machine, ensuring user safety and control during operation. Additionally, a mounted tray on the right side holds a computer monitor, keyboard, and CPU, providing an integrated interface for process control.
Inside, the machine contains wafer handling robotic arms or gripper mechanisms visible through a wire-mesh glass panel, designed for precise wafer manipulation. The interior surfaces are clean and reflective, suggesting careful maintenance. Two white plastic containers connected with tubes are present, likely serving as reservoirs for chemicals or fluids used in the cleaning process.
Key features include cleaning by submersion in solvent mixtures, fan spray processing with nitrogen drying, and a dry-in/dry-out system for efficient wafer handling. The proprietary soak and spray technology minimizes spray time and chemical usage, reducing operational costs. Enhanced efficiency is achieved with the capability to remove 100% of photoresist and sidewall fluoropolymer residues up to five times faster than spray-only methods. The equal-time soak software ensures precise process control by maintaining consistent soak times in heated, recirculating solvents. High-pressure spray stages effectively remove residual contaminants after soaking.
This machine is particularly suitable for post-DRIE etch TSV cleaning, which is critical for the reliability of 2.5D and 3D integrated circuit devices. Safety warnings about moving parts and pinch points are clearly displayed to protect operators during use.
Power Specifications:
- Voltage: 208 VAC
- Phase: 3PH
- Frequency: 60Hz
- Current: 30 AMP
This combination of advanced cleaning technology and integrated controls makes the SSEC M3302 a valuable asset for semiconductor manufacturing environments requiring reliable and efficient wafer cleaning.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Offer Title: SSEC 3302 Resist Removal and Wafer Cleaning Machine
Manufacturer: Ssec
Model: M3302
Technical Condition: Good
Date of Manufacture: August 30, 2005
Power Specifications:
- Voltage: 208 VAC
- Phase: 3PH
- Frequency: 60Hz
- Current: 30 AMP
Key Features:
1. Cleaning by submersion: The wafer is soaked in a mix of solvents for effective cleaning.
2. Fan Spray Processing: Processing includes spray solvents followed by a nitrogen drying stage.
3. Dry-in/Dry-out System: Designed for efficient handling of dry wafers in and out of the system.
4. Proprietary Soak and Spray Technology: Minimizes spray time and chemistry use, resulting in lower cost-of-ownership compared to conventional methods.
5. Enhanced Efficiency: Achieves 100% photoresist and sidewall fluoropolymer removal 5 times faster than spray-only methods.
6. Equal-time Soak Software: Provides precise process control by ensuring each wafer soaks in heated, recirculating solvent adequately.
7. High-pressure Spray: Rapidly removes remaining residue after soaking, ensuring complete cleaning.
8. Significant Time and Chemistry Savings: Soak and spray process takes 88% less time and 77.5% less chemistry than traditional spray-only processes.
This machine is ideal for post DRIE etch TSV cleaning, essential for the reliability of 2.5D and 3D IC devices.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Machinery dealer |
| Active since | 2014 |
| Offers online | 24 |
| Last activity | March 27, 2026 |
Offer Title: SSEC 3302 Resist Removal and Wafer Cleaning Machine
Manufacturer: Ssec
Model: M3302
Technical Condition: Good
Date of Manufacture: August 30, 2005
Power Specifications:
- Voltage: 208 VAC
- Phase: 3PH
- Frequency: 60Hz
- Current: 30 AMP
Key Features:
1. Cleaning by submersion: The wafer is soaked in a mix of solvents for effective cleaning.
2. Fan Spray Processing: Processing includes spray solvents followed by a nitrogen drying stage.
3. Dry-in/Dry-out System: Designed for efficient handling of dry wafers in and out of the system.
4. Proprietary Soak and Spray Technology: Minimizes spray time and chemistry use, resulting in lower cost-of-ownership compared to conventional methods.
5. Enhanced Efficiency: Achieves 100% photoresist and sidewall fluoropolymer removal 5 times faster than spray-only methods.
6. Equal-time Soak Software: Provides precise process control by ensuring each wafer soaks in heated, recirculating solvent adequately.
7. High-pressure Spray: Rapidly removes remaining residue after soaking, ensuring complete cleaning.
8. Significant Time and Chemistry Savings: Soak and spray process takes 88% less time and 77.5% less chemistry than traditional spray-only processes.
This machine is ideal for post DRIE etch TSV cleaning, essential for the reliability of 2.5D and 3D IC devices.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| ------------------- | |
| worked hours | |
| hours under power | |
| state | good |
| At local norms | --------- |
| status | visible |
| Last availability date | 25/03/2025 |
Offer Title: SSEC M3302 Resist Removal and Wafer Cleaning Machine
Manufacturer: Ssec
Model: M3302
Year of Manufacture: Not specified
This semiconductor wafer equipment is designed for efficient resist removal and wafer cleaning processes. The machine features a reflective stainless steel exterior and is equipped with two cassette holders labeled 'CASSETTE 1' and 'CASSETTE 2' for wafer input and output, facilitating organized wafer handling. The front panel includes a 'CORROSIVES' label, indicating the machine is intended to process corrosive materials safely.
Operational controls include an emergency stop button and start/stop push buttons located on the right side of the machine, ensuring user safety and control during operation. Additionally, a mounted tray on the right side holds a computer monitor, keyboard, and CPU, providing an integrated interface for process control.
Inside, the machine contains wafer handling robotic arms or gripper mechanisms visible through a wire-mesh glass panel, designed for precise wafer manipulation. The interior surfaces are clean and reflective, suggesting careful maintenance. Two white plastic containers connected with tubes are present, likely serving as reservoirs for chemicals or fluids used in the cleaning process.
Key features include cleaning by submersion in solvent mixtures, fan spray processing with nitrogen drying, and a dry-in/dry-out system for efficient wafer handling. The proprietary soak and spray technology minimizes spray time and chemical usage, reducing operational costs. Enhanced efficiency is achieved with the capability to remove 100% of photoresist and sidewall fluoropolymer residues up to five times faster than spray-only methods. The equal-time soak software ensures precise process control by maintaining consistent soak times in heated, recirculating solvents. High-pressure spray stages effectively remove residual contaminants after soaking.
This machine is particularly suitable for post-DRIE etch TSV cleaning, which is critical for the reliability of 2.5D and 3D integrated circuit devices. Safety warnings about moving parts and pinch points are clearly displayed to protect operators during use.
Power Specifications:
- Voltage: 208 VAC
- Phase: 3PH
- Frequency: 60Hz
- Current: 30 AMP
This combination of advanced cleaning technology and integrated controls makes the SSEC M3302 a valuable asset for semiconductor manufacturing environments requiring reliable and efficient wafer cleaning.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2014 |
| Offers online | 24 |
| Last activity | March 27, 2026 |
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