Price on request
View price| Manufacturer | Gasonics |
|---|---|
| Model | 9104 |
| Year | |
| Location | USA
|
| Category | Semiconductors - Wafer equipment |
| Product id | P241023247 |
| Language |
| Wafer size | 8 in |
| ------------------- | |
| worked hours | |
| hours under power | |
| state | good |
| At local norms | yes |
| status | |
| Last availability date | 05/02/2026 |
The Gasonics 9104 Ash/Etch System is designed for semiconductor wafer processing, compatible with wafer sizes up to 20.32 cm (8 inches). It features a quartz process chamber with a diameter of approximately 14 inches (about 35.5 cm) and a depth of 20 inches, suitable for fluorinated chemistry applications. The chamber includes external RF electrodes and is equipped with a quartz-coated thermocouple for temperature monitoring.
This system utilizes an ENI OEM 12B RF generator delivering 1250 watts at 13.56 MHz, air-cooled with an automatic impedance matching network; water cooling is available as an option. The process pressure can be controlled within a range of approximately 120 to 2000 mtorr. Stainless steel plumbing ensures durability and low particulate contamination.
Control is managed via a multi-channel single-board computer featuring a color 12.1-inch touch screen for process monitoring and control, supporting automatic recipes as well as manual plasma treatments. The control panel includes an emergency stop button, ON and OFF buttons, a numeric keypad, and a floppy disk drive for data storage.
Gas delivery includes two mass flow controllers with stainless steel VCR fittings, each capable of handling up to 500 sccm, with options for additional gas channels. Power requirements are 208 to 240 volts, 3-phase, 50/60 Hz with a 5-wire wye configuration.
The system is housed in a stainless steel enclosure with a NEMA-12 wall-mounting design, featuring a locking handle for security. The enclosure contains the AC power control, power supply, and pump, allowing for a single power source connection. The equipment shows a clean exterior with minor signs of use, including a small area of discoloration near the circular chamber window frame and some wear on the separate electronic control unit. The circular window glass is clear and intact, and the back panel includes various connectors, cooling fans, and emergency stop controls, all in good condition.
This Gasonics 9104 system is CE certified and suitable for processing 4", 6", and 8" wafers, with capacities of approximately 100 wafers for 4", 50-75 for 6", and 50 for 8" wafers.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Gasonics/IPC 9104 Ash/Etch system
12"(dia) x 20"(D) quartz barrel
soft pumping and purge valving
low particulate design
2ea mass flow gas inputs with VCR fittings
all SS plumbing,
multi channel/single board computer controlled, with floppy storage
temperature monitor
ENI OEM 12B 1250W RF Generator
Wafer Size: 4", 6", 8" capability
Capacity: 50 8" wafers, 50-75 6" wafers, 100 4" wafers.Â
Chamber: Quartz, compatible with fluorinated chemistry. 12" diameter x 20" deep. External RF electrodes.
RF Generator: 1250 watt 13.56 MHz air cooled with automatic impedance matching network. Water cooled optional.
Process Pressure: Approx. 120 - 2000 mtorr.
Stainless Steel Plumbing.
Temperature Monitor: Quartz-coated thermocouple located in the process chamber.
Display: Color 12.1" touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments.
Four user specified gases, with 500 sccm Stainless Steel MFCs come standard with an optional 3rd and/or 4th gas channel available.
Power Requirements: 208 - 240 volts, 3 phase, 50/60 Hz 5 wire "wye".
A NEMA-12 wall mounting enclosure with locking handle contains the AC power control for the asher, power supply, and pump, allows for a single source drop for the complete system.
CE Certified.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 59 |
| Last activity | April 23, 2026 |
Gasonics/IPC 9104 Ash/Etch system
12"(dia) x 20"(D) quartz barrel
soft pumping and purge valving
low particulate design
2ea mass flow gas inputs with VCR fittings
all SS plumbing,
multi channel/single board computer controlled, with floppy storage
temperature monitor
ENI OEM 12B 1250W RF Generator
Wafer Size: 4", 6", 8" capability
Capacity: 50 8" wafers, 50-75 6" wafers, 100 4" wafers.Â
Chamber: Quartz, compatible with fluorinated chemistry. 12" diameter x 20" deep. External RF electrodes.
RF Generator: 1250 watt 13.56 MHz air cooled with automatic impedance matching network. Water cooled optional.
Process Pressure: Approx. 120 - 2000 mtorr.
Stainless Steel Plumbing.
Temperature Monitor: Quartz-coated thermocouple located in the process chamber.
Display: Color 12.1" touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments.
Four user specified gases, with 500 sccm Stainless Steel MFCs come standard with an optional 3rd and/or 4th gas channel available.
Power Requirements: 208 - 240 volts, 3 phase, 50/60 Hz 5 wire "wye".
A NEMA-12 wall mounting enclosure with locking handle contains the AC power control for the asher, power supply, and pump, allows for a single source drop for the complete system.
CE Certified.
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Wafer size | 8 in |
| ------------------- | |
| worked hours | |
| hours under power | |
| state | good |
| At local norms | yes |
| status | |
| Last availability date | 05/02/2026 |
The Gasonics 9104 Ash/Etch System is designed for semiconductor wafer processing, compatible with wafer sizes up to 20.32 cm (8 inches). It features a quartz process chamber with a diameter of approximately 14 inches (about 35.5 cm) and a depth of 20 inches, suitable for fluorinated chemistry applications. The chamber includes external RF electrodes and is equipped with a quartz-coated thermocouple for temperature monitoring.
This system utilizes an ENI OEM 12B RF generator delivering 1250 watts at 13.56 MHz, air-cooled with an automatic impedance matching network; water cooling is available as an option. The process pressure can be controlled within a range of approximately 120 to 2000 mtorr. Stainless steel plumbing ensures durability and low particulate contamination.
Control is managed via a multi-channel single-board computer featuring a color 12.1-inch touch screen for process monitoring and control, supporting automatic recipes as well as manual plasma treatments. The control panel includes an emergency stop button, ON and OFF buttons, a numeric keypad, and a floppy disk drive for data storage.
Gas delivery includes two mass flow controllers with stainless steel VCR fittings, each capable of handling up to 500 sccm, with options for additional gas channels. Power requirements are 208 to 240 volts, 3-phase, 50/60 Hz with a 5-wire wye configuration.
The system is housed in a stainless steel enclosure with a NEMA-12 wall-mounting design, featuring a locking handle for security. The enclosure contains the AC power control, power supply, and pump, allowing for a single power source connection. The equipment shows a clean exterior with minor signs of use, including a small area of discoloration near the circular chamber window frame and some wear on the separate electronic control unit. The circular window glass is clear and intact, and the back panel includes various connectors, cooling fans, and emergency stop controls, all in good condition.
This Gasonics 9104 system is CE certified and suitable for processing 4", 6", and 8" wafers, with capacities of approximately 100 wafers for 4", 50-75 for 6", and 50 for 8" wafers.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Machinery dealer |
| Active since | 2019 |
| Offers online | 59 |
| Last activity | April 23, 2026 |