5,900 $
Make an offerContact us to receive an offer.
| ------------------- | |
| worked hours | |
| hours under power | |
| state | like new |
| At local norms | --------- |
| status | |
| Last availability date | 19/02/2025 |
The Soptop ST60N is an aluminum wire bonding machine designed for precision semiconductor assembly tasks. This unit features a main machine body equipped with multiple control knobs and switches that allow for detailed adjustments, including ultrasonic power, bonding time, and pressure settings. These controls provide the operator with flexibility to fine-tune the bonding process according to specific requirements.
A microscope with a 2X lens is integrated into the machine, facilitating close-up viewing of the bonding area to ensure accuracy during operation. The work platform is designed with a black and silver striped pattern and includes a small mounted circuit board fixture, providing a stable and secure area for positioning components during bonding.
Illumination of the work area is supported by a flexible black lamp, which can be adjusted to direct light precisely where needed, enhancing visibility during delicate bonding procedures. Additionally, a small wrench tool is included and is seen lying beside the machine, likely intended for maintenance or adjustment purposes.
The machine is described as never used and in like-new condition, indicating that it has not undergone prior operational use. However, no information is provided regarding the year of manufacture or any testing status. This equipment is suitable for semiconductor manufacturing environments requiring detailed wire bonding capabilities with adjustable parameters and visual support.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
Soptop ST60N Aluminum Wire Bonding Machine
Machine never used, like new condition
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| Client type | Factory – small or medium company |
| Active since | 2025 |
| Offers online | 1 |
| Last activity | Feb. 19, 2025 |
Soptop ST60N Aluminum Wire Bonding Machine
Machine never used, like new condition
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase
| ------------------- | |
| worked hours | |
| hours under power | |
| state | like new |
| At local norms | --------- |
| status | |
| Last availability date | 19/02/2025 |
The Soptop ST60N is an aluminum wire bonding machine designed for precision semiconductor assembly tasks. This unit features a main machine body equipped with multiple control knobs and switches that allow for detailed adjustments, including ultrasonic power, bonding time, and pressure settings. These controls provide the operator with flexibility to fine-tune the bonding process according to specific requirements.
A microscope with a 2X lens is integrated into the machine, facilitating close-up viewing of the bonding area to ensure accuracy during operation. The work platform is designed with a black and silver striped pattern and includes a small mounted circuit board fixture, providing a stable and secure area for positioning components during bonding.
Illumination of the work area is supported by a flexible black lamp, which can be adjusted to direct light precisely where needed, enhancing visibility during delicate bonding procedures. Additionally, a small wrench tool is included and is seen lying beside the machine, likely intended for maintenance or adjustment purposes.
The machine is described as never used and in like-new condition, indicating that it has not undergone prior operational use. However, no information is provided regarding the year of manufacture or any testing status. This equipment is suitable for semiconductor manufacturing environments requiring detailed wire bonding capabilities with adjustable parameters and visual support.
The following description has been generated using artificial intelligence based on the product information available. It is provided for guidance only and may not reflect all specifications or conditions. Please contact us if you need precise or confirmed details.
| Client type | Factory – small or medium company |
| Active since | 2025 |
| Offers online | 1 |
| Last activity | Feb. 19, 2025 |
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